Abstract: The utility model relates to an LED integrated package bracket, which comprises a metal substrate, a frame and a pin. The metal substrate has a plurality of grooves arranged in a certain shape and depth, and the metal substrate is fixed in the frame, and The pin is connected to the external circuit through the frame. The use of such an integrated package holder for LED packaging can greatly improve the side light extraction efficiency of the LED chip and improve the brightness of the LED light source after packaging.
Claim
1. An LED integrated package bracket, which is characterized in that: a metal substrate, a frame and a lead are formed, wherein the front surface of the metal substrate has a plurality of grooves arranged in a certain shape and depth, and the frame is wrapped around the metal substrate. The feet are attached to the metal substrate and are led out of the frame.
The LED integrated package holder according to claim 1, wherein the number of grooves on the front surface of the metal substrate is 2 to 500, and the arrangement shape is circular or square.
The metal substrate according to claim 2, wherein the groove shape is circular or square, the depth is 0.05-1 mm, and the diameter of the bottom surface of the groove or the side length is 1.5-4 mm. The angle between the side and the bottom surface is 90°-170°.
4. The metal substrate according to claim 2, wherein the spacing between the grooves is 0.1-20 mm.
Instruction manual
Technical field
The utility model relates to an LED integrated package bracket, which is mainly used for integrated packaging of high-power LEDs, and belongs to the field of semiconductor illumination .
Background technique
As a new type of solid light source, LED (Light Emitting Diode) has developed rapidly due to its small size, fast response, good shock resistance, long life, and especially energy saving and environmental protection. In recent years, it has been widely used in large-screen displays, traffic lights, landscape lighting, street lighting and other fields.
At present, LED packaging is mainly divided into two types: one is a separate package, that is, each chip is separately packaged to produce an independent light source, and then assembled according to needs; the second is integrated packaging, and multiple chips are A certain arrangement, and then integrated packaging, this method encapsulates a multi-chip assembly. Along with the rapid development of the LED market , integrated packaging is increasingly used in various fields such as lamps and backlights. Taking street lamps as an example, more and more enterprises adopt integrated packaging in order to facilitate secondary light distribution. However, the current integrated package has two insurmountable disadvantages compared with the separate package reassembly: First, the heat dissipation problem is more prominent. After the integrated package, multiple chips are concentrated on a small area, which makes the heat dissipation problem The problem of street lamps produced by separate packaging and reassembly is more prominent. Secondly, the brightness problem is high. At present, the brightness of the light source of the individual package is higher, and the LED light source integrated with the same chip is calculated, the light efficiency generally decreases by 20-30%. After analysis, it is believed that there are two main reasons: First, the temperature is too high due to poor heat dissipation, which leads to the decrease of the luminous efficiency of the chip. Secondly, the light guiding problem of the bracket, the light output of the general chip includes the front light. And the sum of the side light, in some horizontal chips, the side light output accounts for 20-25% of the total light output. If this part of the light can not be taken out effectively, the brightness of the encapsulated LED light source will be significantly reduced, in a separate In the package, the bracket is made into a concave bowl shape, and the concave side of the bracket reflects the light, effectively illuminating the side of the chip. In the integrated package, the current brackets are all planar, and the chips are also very close. After being packaged with such a bracket, the side light of the chip is almost completely reflected back and forth between the chips, and is slowly consumed, and cannot be used. Form effective light. Therefore, in order to make the side light of the chip be effectively taken out, it is not wasted, and it is a good choice to draw on the bracket design form of the individual package.
50Mm Dc Spur Gear Motor including 50RS545, 50RS555 and 50RS775 Dc Spur Gear Motor. 50mm DC Spur Gear Motor sometimes is used on welding machines and other devices need high torque. 50mm DC Spur Gear Motor has a better gearbox strength.
50mm dc spur gear motor has 4 kind of stages.
For the 2 stages gearbox, we have 9 gear ratio;
For the 3 stages gearbox, we have 21, 25.5 gear ratios;
For the 4 stages gearbox, we have 50, 60, 72 gear ratios;
For the 5 stages gearbox, we have 118, 141, 170, 205 gear ratios;
| Number of stages | 2 | 3 | 4 | 5 |
| Reduction Ratio | 9 | 21, 25.5 | 50, 60, 72 | 118, 141, 170, 205 |
| Gearbox Length(L) mm | 20.4 | 24.9 | 29.4 | 33.9 |
| Breaking Torque(kg f.cm) | 25 | 30 | 90 | 90 |
| Gearbox efficiency | 81% | 72% | 65% | 59% |
50mm DC Spur Gear Motor
50Mm Dc Spur Gear Motor,50Mm Gear Motor,50Mm Dc Gear Motor,50Mm Planetary Gear
SHENZHEN DONGMING MOTOR CO., LTD. , http://www.dongminggp.com