Molex Interconnect Solutions

From March 18th to 20th, Molex once again participated in the 2014 Electron China 2014 held at the Shanghai New International Exhibition Center and displayed a wide range of products including automotive, industrial, data communication, medical And the latest selection of interconnect products in the mobile space.

Larry Wagner, Director of Global Market Communications at Molex, stated: “We are very pleased to attend the Shanghai Electronics Show in Munich again. We have a strong presence in China, and this time we have demonstrated a variety of interconnection solutions that will reflect this capability. We are actively expanding The main areas of high-growth markets in China are dedicated to working together with Chinese industry, collaborating with customers, providing them with suitable solutions, and accelerating time-to-market for products in today’s highly competitive Chinese environment.”

Visitors will have the opportunity to meet with Molex experts to discuss specific industry solutions provided by Molex.

Molex interconnect solutions for the automotive industry include the HSAutoLinkTMII sealed interconnect system. This powerful sealing system provides up to 5Gbps data rates and supports high-speed media protocols including USB 3.0 to meet the growing bandwidth requirements of advanced in-vehicle infotainment, in-vehicle information systems, and camera devices

Industry-wide interconnect products include the Brad® SSTTM Actuator Sensor Interface (AS-i) module. This module is suitable for a variety of industrial automation applications including conveyor control, packaging equipment, process control valves, bottling plants, distribution systems, airport baggage conveyors, elevators, bottling lines and food production lines.

Molex's data communications technology products include a compact zCDTM interconnect system that can support applications in next-generation telecommunications, networking, and enterprise computing environments. Molex zCD Interconnects Deliver Data at 400Gbps Data Rates (16 Channels at 25Gbps) with Excellent Signal Integrity and Electromagnetic Interference (EMI) Protection

• The new additions to the Molex medical portfolio are the HOZOX EMI Absorption Bands and Absorbent Sheets. HOZOX Absorption Technology uses a unique two-layer design to minimize EMI noise and is particularly suitable for high-frequency medical device manufacturers.

Mobile connectivity solutions include the company's expanded portfolio of micro-SIM card sockets designed for smartphones, tablets and other space-constrained devices. Molex micro-SIM sockets feature high contact and advanced card retention features. The new card-tray model provides protection and allows users to insert and withdraw cards.

Medical and Connector Innovation Forum

In addition, Molex played a leading role in the Medical and Connector Innovation Forum, and John Horgan, Senior Director of the Molex Antennas Business Unit, presented a briefing on March 18 at 2:00 PM in Room M3 in Hall W3 to discuss the integration of more and more electronic products. As the degree increases, the packaging of circuits and components has become a more challenging process. He will explain in detail how Laser Direct Structuring (LDS) technology can help solve these problems through the integration of electronic circuits and plastic structural components.

Then, Mark Schuerman, Molex Regional Business Development Manager, delivered a speech at the Connector Forum in Room M10 of Hall W3 on March 19 at 2:00 PM on the theme of “Leading Automation Trend and Connector Market”. He will discuss the current global situation. In the market environment, companies increasingly rely on the production of products in the local market; respond quickly to changing consumer trends and deploy quickly when opportunities arise to succeed. He will explore the impact of these trends on industrial control and automation strategies, and how industrial connectivity innovation can help companies meet these challenges and maintain competitive advantages.