With the disclosure of Jingke Electronics' first-half annual report, the company achieved operating income of RMB 244,155,097.14, a year-on-year increase of 262.21%. Behind the revenue is the continued full capacity of Jinke's production capacity, and the fourth season is expected to continue to bring good results.
Jingke Electronics said that due to the strong demand for white LEDs, LED white light applications are expected to enter the off-season in the fourth quarter, but Korean and mainland customers are still influx, plus LED backlight applications and smart phone flash. It will also grow at the same time. In October, there will be an opportunity to challenge the full capacity of the production capacity, which will drive the fourth quarter operation to be better than expected.
Jingke Electronics said that since January 2015, due to the reflow of orders from some large customers, Jingke Electronics has expanded its production several times and entered the new era of full capacity from the first quarter. Jingke Electronics currently has an SMD capacity of 1000 KK/M; a high-power LED product of 12 KK/M; and a COB product of 3 KK/M. The large-scale production capacity of Jingke Electronics directly reflects its strong supply system and strong control over product costs.
At the same time, Jingke Electronics said that the demand for LED backlights has been slow in 2016. The peak season of TV backlights started in March-April, and it will only start in June this year. Although it is late, there should be a peak season effect in the third quarter. Jingke Electronics pointed out that it has screened the backlight LED orders, locked stable and differentiated products, and the product mix is ​​getting better and better. The current capacity utilization rate has climbed from 90% to full load.
As the most mature flip-chip solderless gold-free package technology and white-chip chip-level packaged LED, Jingke Electronics will continue to increase its R&D investment in LED backlighting and Lighting, based on its innovative capabilities in packaging technology. Improve existing products, develop new products, and maintain a leading position in flip chip, chip scale packaging, integrated packaging, intelligent lighting, and backlight solutions. At the same time, it will continue to improve production efficiency, reduce product costs, and improve its own market competitive advantage. In addition, we will continue to expand sales channels to cope with the upcoming market competition risks.
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