On June 25, Dow Corning Electronics Industries introduced OE-8001 wafer adhesive, an integrated thermoset polymethyl silicone resin adhesive specifically designed for LED manufacturing.
Dow Corning® OE-8001 Binder can make up for some of the shortcomings of existing materials. Its adhesion is superior to conventional silicone wafer adhesives, and its thermal stability is superior to conventional epoxy wafer adhesives. This newly developed binder was developed specifically for good needle transfer technology to help improve operability during application. It has a lower viscosity change at room temperature and is therefore more convenient to handle.
Kaz Maruyama, Global Marketing Director, Dow Corning Electronics Industry, said, "The silicone LED materials are designed to meet the challenges of the LED manufacturing industry, including high adhesion, high purity, moisture resistance, thermal and light stability, and optical transmission; Compared to some organic materials, silicones retain their transparency at elevated temperatures."
Because Dow Corning® OE-8001 has good transparency and high modulus retention over a wide temperature range, LED products made from this material will have good light transmission and excellent durability.
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