TSMC, Intel, and Samsung Electronics reached a consensus in 2008 to announce that they will enter the 18-inch wafer generation in 2012 to conduct trial production. There is only about 1 year left, but 2 in the past. After three years of low economic growth, semiconductor manufacturers have reduced capital expenditures, equipment manufacturers have also suffered heavy losses, and 18-inch wafer equipment costs are not cheap, leaving many equipment manufacturers stagnant. In the past, during the development of 18-inch wafers, Only research units including Sematech and Belgium Microelectronics Institute (IMEC) are more active.
Among them, IMEC officially opened a newly expanded clean room in mid-June to conduct 18-inch chip research, including the Tokyo Electron (TEL) lithography machine and ASML EUV machine. At the end of 2010, IMEC chief executive Luc Van den Hove pointed out that despite the booming economy, semiconductor equipment makers are eager to invest in the development of 18-inch wafer equipment, but due to the large amount of investment, they will still face considerable challenges in the future.
In the industry, Intel first confirmed that the 18-inch wafer program is in place. The D1X R&D fab in Oregon is planned to begin operation in 2013. The plant will be compatible with 18-inch wafer technology. As for TSMC, the development of some of the machines is still not in place. The progress of 18-inch wafers is slower than the company originally expected.
Taiwan Semiconductor Manufacturing Co., Ltd. pointed out that the development of 18-inch wafers is very promising and hopes that the development of the industry can be accelerated. If it can meet the cost-effectiveness of investment, it can be introduced into production. TSMC’s latest Fab 15 series is planned with a 12-inch plant. The future Fab 16 has not yet been planned. However, if 18-inch wafers are developed in time, the new plant will retain flexibility and, as the case may be, compatible with 18-inch wafers.
Semiconductor industry experts pointed out that from past experience, larger-sized wafers do have benefits. However, there are still many deficiencies in the development of equipment. The industry is also developing next-generation lithography technology, hoping to continue the development of 12-inch wafers. However, the number of equipment manufacturers actually investing in the development of 18-inch wafers is not large, making the time for the 18-inch wafer fabs likely to be postponed.
Among them, IMEC officially opened a newly expanded clean room in mid-June to conduct 18-inch chip research, including the Tokyo Electron (TEL) lithography machine and ASML EUV machine. At the end of 2010, IMEC chief executive Luc Van den Hove pointed out that despite the booming economy, semiconductor equipment makers are eager to invest in the development of 18-inch wafer equipment, but due to the large amount of investment, they will still face considerable challenges in the future.
In the industry, Intel first confirmed that the 18-inch wafer program is in place. The D1X R&D fab in Oregon is planned to begin operation in 2013. The plant will be compatible with 18-inch wafer technology. As for TSMC, the development of some of the machines is still not in place. The progress of 18-inch wafers is slower than the company originally expected.
Taiwan Semiconductor Manufacturing Co., Ltd. pointed out that the development of 18-inch wafers is very promising and hopes that the development of the industry can be accelerated. If it can meet the cost-effectiveness of investment, it can be introduced into production. TSMC’s latest Fab 15 series is planned with a 12-inch plant. The future Fab 16 has not yet been planned. However, if 18-inch wafers are developed in time, the new plant will retain flexibility and, as the case may be, compatible with 18-inch wafers.
Semiconductor industry experts pointed out that from past experience, larger-sized wafers do have benefits. However, there are still many deficiencies in the development of equipment. The industry is also developing next-generation lithography technology, hoping to continue the development of 12-inch wafers. However, the number of equipment manufacturers actually investing in the development of 18-inch wafers is not large, making the time for the 18-inch wafer fabs likely to be postponed.