With the blue and white light-emitting diodes (LEDs) moving towards practicality in 1990, LEDs are not only used for full-color displays, but also in recent years, the public has attached great importance to energy-saving issues. The diversified product application fields such as smartphones, personal computers (PCs), TV backlights, lighting, white goods, or traffic signs are becoming more and more widespread. In order to meet market demands, the industry has devoted considerable attention to various product series, including lighting LEDs that can achieve high color rendering and high reliability, small and thin LEDs represented by PICOLED products, and customized color LEDs for vehicles. R & D resources.

The output value of white LED for lighting grows rapidly

Affected by the world's energy conservation trends and the rising awareness of energy conservation caused by the Great East Japan Earthquake, the demand for white LEDs for lighting in the Japanese market has increased significantly, prompting the LED lighting market output value to continue to grow rapidly. The conversion of incandescent bulb lighting to LED lighting still has some problems that need to be solved in terms of product characteristics. Among them, the industry's research and development focuses on the high color rendering and high reliability of LED lamps. The following will be employed for high Ra values Share with luminous efficiency technology.

Both high Ra value and luminous efficiency

The average color rendering index (Ra) is an index that the light source causes the object to express or reproduce the true color. The higher the index, the better the color reproducibility (Ra of sunlight is 100). The market expects white light for lighting LED can have both high luminous efficiency and high color rendering (Ra ≧ 80), but there is a trade-off characteristic between luminous efficiency and Ra value. Since the market has higher requirements for luminous efficiency, the current market is mostly Ra ≒ 70 high luminous efficiency LEDs.

The packaging structure of a general white LED lamp is to mount a blue LED chip on a substrate and then encapsulate it with a resin containing phosphor. When the luminous color of the LED element (blue) and the luminescent color of the phosphor (yellow, red, green, etc.) are mixed, white light is formed.

From the point of view of luminous efficiency, blue light + yellow light are generally used to form white light, but this will cause poor reproducibility of red light, so it is not suitable for lighting applications. The solution generally adopted is to increase the composition of red light, thereby improving the reproducibility of red light, but this will cause the problem of undesirable luminous efficiency.

In order to take into account both high luminous efficiency and high Ra value, the industry has effectively placed the phosphor inside the package, using the best of both worlds as a solution, and successfully developed a product with Ra ≥ 80 and extremely high luminous efficiency. The performance of this series of products on the Ra or R9 (red) index is very good. Compared with other brands of the same Ra value, this series of products has a higher R9 value and better red reproducibility. . With the breakthrough of this technology, LED lights can not only reduce the unevenness of chromaticity, but also respond to more detailed chromaticity levels.

High reliability

In recent years, the demand for reliability in the market has become increasingly high. Especially due to the high reflectivity of LED packages, silver plating is generally used, but silver will cause LED beam degradation due to vulcanization (a phenomenon of blackening due to reaction with sulfur), which is caused by outdoor LED lights. There is a serious problem, so various manufacturers have to put forward various countermeasures for silver plating solutions, but at present this problem cannot be completely improved.

In view of this, the industry abandoned the silver plating method and adopted the nickel / gold plating method. After changing the silver plating of the LED package to nickel plating / gold plating, although it will lead to increased costs and poor luminous efficiency due to the decrease in reflectivity, these problems have been successfully overcome after the improvement of the packaging structure.

The new package structure not only maintains high luminous efficiency, but also achieves high-reliability LED luminous performance. This series of products has shown excellent performance even in the vulcanization test, which can completely avoid the phenomenon of beam degradation.

LED small / thin

As mobile devices are lighter, thinner and shorter, the demand for small-pitch products in the market is increasing year by year, and parts are also facing more requirements for reducing height and reducing size. In addition, since most outdoor full-color display devices use LEDs, in order to improve performance, full-color LED packages are also developing toward higher density.

Component technology

In order to make the package smaller and thinner, the internal LED components must also adopt small and thin specifications. Therefore, the manufacturers have adopted self-developed process technology from the formation of the light-emitting layer on the wafer to the waferization, and finally successfully reduced the element size of the aluminum gallium indium phosphide (AlGaInP) light-emitting LED to a corner of 0.13 mm (mm), Thickness t = 50 microns (μm), achieving the goal of miniaturization in one fell swoop.

Molding technology

In order to ensure the strength of the product, the manufacturer proposes a processing method for sealing the semiconductor element with resin. The resin sealing processing system uses the Transfer Molding method, but the cavity of the casting mold will become thinner and thinner (the cavity thickness is 0.10 mm), so it is necessary to ensure the fluidity of the resin. In addition, in order to ensure the optical characteristics of the LED, it is impossible to add filler materials to ensure the strength of the parts. As a result, the mechanical strength of the product will be reduced, but the above problems have been solved.

Assembly technology

In the production of LED chips, the LED elements must be soldered in a sealing resin with a thickness of t = 0.10 mm. Therefore, the manufacturer successfully developed a wire bonding machine that successfully reduced the pitch and lowered the circuit.

At present, the world's smallest ultra-compact LED is only 1006 in size and 0.2 mm in thickness. This product is not limited by the installation space. It uses high-brightness LED components and emits light through the LED to allow light to pass through the inside of the mobile phone case. Through lighting.

Not only that, ultra-small LEDs are also suitable for dot matrix displays. Traditional 1608 size products have a minimum pitch of 2 mm, while ultra-small LEDs can be mounted with high density at a minimum pitch of 1.5 mm, so they can exhibit more detailed performance.

In other features, because the package size of this solution is extremely small, it can be used in seven-segment displays and dot matrix display modules, and the die-bonding (Die-bonding) necessary for chip direct packaging (COB) technology is omitted. ), Wire bonding, resin bonding (Bonding) and other processes.

LED lighting for vehicles attracts attention

With the rapid popularization of LED bulbs and lighting applications, automotive LED lighting is more popular than ever in the market. In the interior use of vehicles, whether it is the main backlight of car audio, car navigation systems or air conditioning panels, LED light sources have been almost fully adopted. Next, indoor lights and warning lights that still use traditional bulbs, and instrument panel backlights that use cold cathode tubes will gradually face the fate of replacement.

In the exterior of the vehicle, in recent years, traditional bulbs such as taillights, turn signals, positioning lights, etc. have been gradually replaced, and even the headlights have been changed from traditional halogen lamps and high-intensity discharge (HID) lamps to LED lamps. Replaced by. From the point of view of environmental discrimination, the trend of using LED lights as DayTIme Running Lamps (DRL) is more worthy of attention.

In order to meet the diversified demands of vehicles, the industry will focus on the following two items in the research and development of automotive LED technology.

Customized requirements for chroma and brightness

In the interior of the car, most of the light sources around the instrument panel, such as air conditioning panels, are specified by the car manufacturer. The aluminum gallium indium phosphide component LED series products introduced by the manufacturer, relying on the advantages of self-made components, can be customized according to customer requirements, regardless of color or luminosity.

Others, such as the white and pink LED series successfully created with InGaN and phosphor-containing resins, can also provide color customization. Keys that are used more frequently, such as the backlight of the main key, can highlight the difference between them and the adjacent key through subtle color differences, thereby arousing the user's attention. This aluminum gallium indium phosphide element uses the technology to suppress the wavelength difference in the epitaxial growth stage, so it can meet the strict specifications of customers.

Development of vulcanization-resistant measures / expansion of new products

On the other hand, the market ’s maximum requirements for LED lights for exterior applications such as taillights are heat resistance and resistance to harsh climates. However, because the traditional LED package lead frame is silver-plated, it is prone to sulfidation and light beams. Deterioration problem, this problem is now beginning to be paid attention to.

In view of this, the industry changed nickel plating / palladium plating / gold plating as lead frame materials to successfully solve the problem of beam degradation caused by vulcanization. In addition, for the shortcomings of brightness reduction caused by nickel plating / palladium plating / gold plating, the industry has also developed a new series of products, which are solved by improving the output efficiency of the device itself, showing a beam intensity no less than that of silver-plated products . In the future, the industry will adopt nickel-plated / palladium-plated / gold-plated as packaging vulcanization improvement measures, and actively expand new product series to meet the diverse needs of customers.

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