Today's LED big screen world, such as the same three kingdoms, swords and swords, bloody hurricane, DIP, SMD, COB three packaging modes are divided, COB packaging in the field of LED display applications has gradually matured, especially in the field of outdoor small spacing With its unique technological advantages, it is a sudden rise. Who is strong and who is weak? Who can finally dominate the world?
First, what is the COB package?
COB package is the abbreviation of English Chip On Board. The literal translation is that the chip is placed on the board. It is a new packaging method that is different from DIP and SMD packaging technology. as the picture shows
In the field of LED display technology, the COB packaging process is to fix the LED bare chip with conductive adhesive or insulating glue on the lamp position pad of the PCB, and then use the ultrasonic welding technology to conduct conductive function wire bonding of the LED chip , and finally use epoxy. The resin glue encapsulates the lamp position to protect the LED light-emitting chip.
Second, the difference between COB packaging process and DIP and SMD packaging process
DIP package, short for dual inline-pin package, commonly known as plug-in display. It was the first of the three package modes. The lamp bead is produced by the LED lamp bead package manufacturer, and then inserted into the LED lamp board of the LED by the LED module and the display manufacturer, and the DIP semi-outdoor module and the outdoor waterproof module are produced through wave soldering.
SMD package, short for Surface Mounted Devices, means: surface mount device, which is one of the SMT (Surface Mount Technology) components. The three-in-one is a kind of LED display SMD technology, which means that the SMT lamps of RGB three different color LED chip packages are packaged in the same glue body at a certain interval.
The DIP and SMD packaging processes are indistinguishable from COB packages in terms of bond wires, the biggest difference being the use of brackets in the red section. As we all know, the bracket generally has four soldering legs and needs to be soldered to the PCB board by SMT. Therefore, the biggest difference between the COB packaging process and the DIP and SMD packaging processes is that the single lamp eliminates a bracket, thus saving the surface-mount welding process of the lamp bead over the reflow soldering machine.
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