Just today, I read a few articles about COB "suitable for spotlights? Who is the COB who deceived?" "After the theory and completion of the COB, I also said a few words", as a patent analyst, I can’t help it...
The seniors have discussed the technical features, advantages and disadvantages of COB packaging and product development. As mentioned in the previous section, there are many types of COB products. This article will limit the chip to be directly fixed on the circuit board or other types of substrates as COB. The COB (Chip On Board) package refers to an LED package technology in which an LED chip is adhered to an interconnect substrate with a conductive or non-conductive paste, and the chip and the circuit board are electrically connected by wire bonding. It can package tens or even hundreds of chips in a small area, and finally form a surface light source. The bare chip is directly exposed to the air, is susceptible to contamination or human factors cause the function of the chip to be affected and destroyed, so the chip and the bonding wire are encapsulated by glue.
Key points:
[early COB patent]
At present, the earliest patent for COB packaging is US patent for US patent number US05788179 filed by IBM Corporation on April 10, 1975. IBM has applied for the same group of patents in Japan, Germany, France, and the United Kingdom. There is no more, the patent has expired and no claims have been retrieved, and we are still back in the present world.
[Who has a core patent]
The original analysis report was written as follows: In the field of COB packaging technology, the number of patent applications was very small before 2008. From 2004, the number of patent applications increased year by year, and from 2004, the number of patent applications increased, and reached in 2012. The peak of the number of patent applications, it can be inferred that since 2004, COB packaging has been produced...
I really don't want readers to back the data, but I know that you are very concerned about the so-called "core patents". For the author who is the true holder of COB patents, we have no conclusions. We have applied for scientific patents from about 2,600 patents worldwide. The cited patent documents in the branch, patent families, claims, and applicants, etc., selected several patents as analysis cases, as the introduction of COB patents.
Matsushita Electric Works Co., Ltd. US10466114 patent
The patent was first filed by Panasonic Electric Works Co., Ltd. on August 28, 2002, and was cited for 20 times; however, it was applied for in the US family patent US10466114 on July 22, 2003, mainly to protect one. A light-emitting device capable of efficiently extracting light from a light-emitting diode (LED) die to the outside of the package, including a metal plate made of aluminum, the metal plate having a protruding portion protruding forward, at the protruding portion (11a) A receiving groove is formed in the front surface. The LED chip is mounted on the bottom surface of the accommodating recess, and heat dissipation is improved due to thermal bonding with the metal plate. An insertion hole into which the protruding portion is inserted is formed through a printed circuit board made of a glass epoxy substrate bonded to the front surface of the metal plate. The LED chip and the bonding wire are sealed by a transparent resin sealing portion. The patent has been cited 319 times, and 13 related patents of Samsung have cited the patent; 22 related patents of LG Company have cited the patent; 14 related patents of CREE have cited the patent; 5 related by Nichia The patent cites the patent.
Do you know how powerful it is?
Cree US7365371B2 patent
Cree is the world's leading provider of integrated technologies and integrated solutions for LED epitaxy, chips, packaging, LED lighting solutions, compound semiconductor materials, power devices and RF technologies. It has more than 1,100 US licensed patents and more than 1,000 US pending patent applications, and has laid out nearly 4,500 patents in various countries and regions outside the United States, of which more than 2,000 have been authorized. Of course, there are inevitably COB packaging patents, and more than 50 US patents related to COB patents.
The COB patent application, which is still in the protection period, was filed on August 4, 2005, which protects: a lower base that mounts an LED chip includes a substrate, a die attach pad configured to receive the LED chip on the upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first sealing region of the upper surface of the substrate, and a second sealing region surrounding the first sealing region on the substrate and defining an upper surface of the substrate The second meniscus control feature. The first and second meniscus control features can be substantially coplanar with the die attach pad. The packaged LED includes a lower base as described above and further comprising an LED chip on the die attach pad, a first encapsulant on the substrate in the first sealing region, and a second sealing region and covering the first encapsulant a second sealant on the substrate. Around the patent Cree also disclosed method patents and luminaire patents, with 16 family patents and 47 references.
Citizen JP2004304041A patent
Citizen has nearly 100 patents related to COB. The earliest patent application was on March 31, 2003. It has the same family patent in Japan, the United States, Germany, and China, and has been cited seven times. The Japanese language writer does not understand. The patent of the Chinese national patent claim:
You said that it is not very powerful?
ã€Overall trend】
Since the COB packaging technology is a printed circuit board in which the LED chips are directly fixed, the pitch of the lamp beads is small, which affects the heat dissipation effect, especially the development of a high-power COB package. Therefore, the future development direction of COB packaging is to have a heat-dissipating substrate, a new package adhesive, develop an efficient LED chip, design and optimize the overall heat dissipation structure, thereby developing a light source with more performance.
As can be seen from Figure 5, the global patents in the field of COB integrated LED technology are mainly concentrated in Korea and Japan. The patentees are SAMSUNG ELECTRO MECH, SEOUL SEMICo nDUCTOR CO LTD in Korea and ROHM CO LTD, PANASo nIC ELEC WORKS COLTD, CITIZEN ELECTRONICS in Japan. , TOSHIBA CORP and other world-renowned semiconductor manufacturers.
If you write here, if you conclude that: through the analysis of COB packaging patents, China has made great progress in the number of original patent applications, followed by Japan, the United States and South Korea ranked third and fourth. Domestic enterprises should pay due attention to expanding the research field, strive to invest research power in COM packaging, strengthen the development of weak areas, increase the layout of patents, and enhance the core technology of China's packaging.
Is there an impulse to draw the author? In order to avoid beating, it is recommended to read the following patents:
If you need to do competitor analysis, you can track and analyze Langmingnas, Youjia Technology Co., Ltd., Guangzhou Silicon Energy Lighting Co., Ltd., Fujian Zhongke Core Source Optoelectronics Technology Co., Ltd., Shenzhen Kaixin Photoelectric Co., Ltd., Foshan Guoxing Optoelectronics company and other companies COB research and development.
Final recommendations:
Technology direction to improve light efficiency: improve the reflective efficiency of package holders, substrates, increase the groove structure layer and use multi-cup integrated COB packaging technology.
Heat dissipation in the technical direction: use ceramic substrate, dielectric layer heat dissipation function MCPCB to improve heat dissipation.
If you want to apply for a patent, spend more time and experience and write the application documents.
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