LED global patent layout

There are more than 120,000 global patent applications in the LED field, of which the largest number of patent applications is in Japan, followed by the United States and China. The patent applications in the LED fields of major countries and regions have exceeded 10,000.

According to the LED's technical characteristics and industry partition habits, the LED field is generally divided into substrate, epitaxy, chip, package, and application. LED global patent technology structure layout as shown in the figure, patent applications 40% concentrated in the package, followed by the application (26%) and epitaxy (17%) areas, the substrate and white light patents. In the substrate field, 25% of the patents were concentrated in sapphire, followed by gallium arsenide (17%), silicon (16%), gallium nitride (10%), etc.; patents in the field of epitaxy.

From the active layer material, 86% is concentrated in the III-V group. From the functional layer, 75% is concentrated in the n-type layer, the p-type layer and the active layer, followed by the cover layer and the buffer layer (16%). Technology branches such as the extension layer and the EU contact layer are less requested; 39% of patents in the field of chips are focused on electrode design technology, followed by reflective film technology (16%), microstructure technology (12%), chip shape technology (11%) Substrate bonding peeling technology (11%), with fewer applications for dicing, AR coating, passivation, etc.; 63% of patents in the packaging field are concentrated on substrates and packages, followed by heat dissipation (15%), Electrode interconnection (13%) and phosphor (7%). The patent applications are mostly concentrated in the packaging and application fields, which shows that the LED technology is relatively mature and has begun to enter the application stage.