New York Governor Andrew Cuomoy announced on Tuesday (27th) that IBM, Samsung, Global Wafers, Intel and TSMC have formed alliances with five technology companies and will invest US$4.4 billion in Albany, New York, in the next five years. Mitech Research plans to join hands to create the next generation computer chip technology research center.
With Moore's Law likely to encounter bottlenecks, the semiconductor industry has begun to face the difficulty of expensive manufacturing equipment, a semiconductor mask device used in a 20-nanometer process is costing hundreds of millions of dollars at a time. It is impossible for a single vendor to load, and manufacturing costs are high. After the manufacturers are pressured, they are often deterred by the high cost. In view of this, manufacturers have adopted technology alliances to reduce R&D costs and continue the advantages of advanced processes. Taiwan Semiconductor foundry TSMC and IBM, Intel, Globalfoundries, and Samsung Electronics form an alliance named “Global 450 Consortium†and invest in nanotechnology research. Participants in the plan include New York State’s investment of US$400 million. . .
IBM spokesman Michael Loughran said that IBM will invest $3.6 billion to develop 22nm computer chips and 14nm process technology. And Intel, IBM, Taiwan Semiconductor Manufacturing Co., and Samsung will all focus on shifting 300mm wafer technology to 450mm, which will double wafer production. Michael Loughran added that this technology will not only create 6,900 job opportunities for New York, but also to boost economic development in New York's North.
IBM and Intel are currently the most technologically advanced manufacturers in the semiconductor industry. According to Jiang Shangyi, senior vice president of TSMC’s research and development, with the bottleneck of Moore’s Law, the difficulty faced by TSMC in advancing the advanced manufacturing process has also increased; however, TSMC’s current progress in the 20-nm trial production is still scheduled for the end of the third quarter of next year. Production.
With Moore's Law likely to encounter bottlenecks, the semiconductor industry has begun to face the difficulty of expensive manufacturing equipment, a semiconductor mask device used in a 20-nanometer process is costing hundreds of millions of dollars at a time. It is impossible for a single vendor to load, and manufacturing costs are high. After the manufacturers are pressured, they are often deterred by the high cost. In view of this, manufacturers have adopted technology alliances to reduce R&D costs and continue the advantages of advanced processes. Taiwan Semiconductor foundry TSMC and IBM, Intel, Globalfoundries, and Samsung Electronics form an alliance named “Global 450 Consortium†and invest in nanotechnology research. Participants in the plan include New York State’s investment of US$400 million. . .
IBM spokesman Michael Loughran said that IBM will invest $3.6 billion to develop 22nm computer chips and 14nm process technology. And Intel, IBM, Taiwan Semiconductor Manufacturing Co., and Samsung will all focus on shifting 300mm wafer technology to 450mm, which will double wafer production. Michael Loughran added that this technology will not only create 6,900 job opportunities for New York, but also to boost economic development in New York's North.
IBM and Intel are currently the most technologically advanced manufacturers in the semiconductor industry. According to Jiang Shangyi, senior vice president of TSMC’s research and development, with the bottleneck of Moore’s Law, the difficulty faced by TSMC in advancing the advanced manufacturing process has also increased; however, TSMC’s current progress in the 20-nm trial production is still scheduled for the end of the third quarter of next year. Production.
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